The 3rd Gen Xeon scalable processors will power advanced supercomputers and HPC systems
Intel said that it will showcase advances in its Xeon processor for high performance computing (HPC) and artificial intelligence (AI) at the ongoing 2021 International Supercomputing Conference (ISC 2021).
The company is also using the event to unveil its innovations in memory, networking technologies, and software, exascale-class storage for a range of HPC use cases.
Compared to the previous generation processor, the 3rd Gen Intel Xeon Scalable processor can offer up to 53% higher performance across various HPC workloads, said Intel.
In comparison to its closest x86 competitor, the latest Intel processor is claimed to provide superior performance across life sciences, financial services, manufacturing and other popular HPC workloads.
Code-named Sapphire Rapids, the next-generation of Intel Xeon Scalable processors will provide integrated high bandwidth memory (HBM). This will help in drastically boosting the memory bandwidth, while significantly enhancing performance for HPC applications operating on memory bandwidth-sensitive workloads.
The ISC 2021 event will also see Intel’s X-HPC-based graphics processing unit (GPU) in action. Code-named “Ponte Vecchio”, the GPU is said to be optimised for HPC and AI workloads.
It utilises Intel’s Foveros 3D packaging technology for integrating various IPs in-package. These include HBM memory and other intellectual property.
Intel said that the new GPU is built with compute, memory, and fabric to handle the changing requirements of Aurora and other advanced supercomputers.
At the ongoing event, the company will announce its new high performance networking with ethernet (HPN) solution as well.
The new solution will extend capabilities of ethernet technology for smaller clusters in the HPC segment. This will be by using standard Intel Ethernet 800 Series Network Adapters and Controllers, the Intel Ethernet Fabric suite software, and also switches based on Intel Tofino P4-programmable Ethernet switch ASICs.
The ISC 2021 event will also be the venue where Intel will introduce commercial support for distributed asynchronous object storage (DAOS).
Intel had built DAOS as an open-source software-defined object store for streamlining data exchange across Intel HPC architectures.
Intel HPC vice president and general manager Trish Damkroger said: “To maximise HPC performance we must leverage all the computer resources and technology advancements available to us.
“Intel is the driving force behind the industry’s move toward exascale computing, and the advancements we’re delivering with our CPUs, XPUs, oneAPI Toolkits, exascale-class DAOS storage, and high-speed networking are pushing us closer toward that realisation.”
Earlier this month, Intel announced the restructuring of its data platform group (DPG) operations into two new business units, of which one of them will be focused on HPC and graphics.