Dubbed as Silicon Heartland, the chip manufacturing project in Licking County, which broke ground recently in the presence of US President Joe Biden, is expected to begin production in late 2025
Bechtel chosen by Intel to build its new semiconductor manufacturing facilities in Ohio. (Credit: Intel Corporation)
Bechtel has been selected by Intel to develop its new $20bn semiconductor manufacturing facilities in Licking County, Ohio.
The US-based engineering, construction, and project management company will design and construct a total of 2.5 million ft2 of the facility, which includes 600,000ft2 of cleanrooms.
It will constitute phase one of Intel’s Silicon Heartland project in New Albany.
Bechtel manufacturing and technology business president Catherine Ryan said: “Bechtel is proud to work with Intel and the people of Ohio to reclaim US semiconductor manufacturing.
“A project of this complexity and magnitude—with an outsized impact on the community and economy—is the type of work Bechtel is uniquely positioned to deliver. We are honoured to be chosen by Intel as its partner and we are ready to build their most advanced semiconductor facilities in the world.”
In September 2022, Intel broke ground on the semiconductor manufacturing site in the presence of US President Joe Biden.
The new semiconductor fab facilities are expected to revitalise chip production in the US. Production from the new fabs is expected to begin in late 2025.
The fabs are expected to manufacture Intel’s leading-edge chips and help in strengthening production to meet the growing demand for advanced semiconductors.
Intel global supply chain operations corporate vice president Jackie Sturm said: “Intel has chosen Bechtel to deliver our largest construction project to date, advancing our mission to create a more sustainable, resilient, and geographically balanced supply of silicon.
“Bechtel has decades of world class expertise in complex global construction projects, leveraging a deeply experienced team, critical craft support and robust analytics platforms.
“Their relentless focus on safety, quality and innovation aligns with Intel key values. We look forward to building the future of US semiconductor manufacturing together.”
Bechtel expects to collaborate with North American Building trades unions and suppliers to generate new construction jobs, and with local educational institutions to establish training programmes.
The company said that the construction of the fabs would need as much steel for constructing eight Eiffel Towers and as much concrete that would be required for the tallest skyscrapers.