The main focus of the collaboration is aimed at driving Foxconn’s efforts in EV platforms, leveraging NXP’s system expertise and electrification portfolio

NXP Semiconductors Foxconn

NXP Semiconductors and Foxconn sign an MoU to expand their collaboration. (Credit: NXP Semiconductors)

NXP Semiconductors and Taiwanese electronics contract manufacturer Hon Hai Technology Group (Foxconn) have inked a memorandum of understanding (MoU) with an aim to co-develop platforms for a new generation of smart connected vehicles.

As per the MoU, Foxconn will make use of the Dutch semiconductor firm’s portfolio of automotive technologies and its know-how in safety and security. This is expected to help in enabling architectural innovation and platforms for electrification, connectivity as well as safe automated driving.

Foxconn chairman Young Liu said: “Foxconn sees the disruptive challenges and the potential for innovation in today’s automotive industry. This is a prime opportunity for our particular electronics expertise.

“NXP’s longstanding expertise and leadership in automotive, its innovative products and its laser focus on safety, security and quality provide the foundation for the collaboration we are activating today.”

The collaboration builds on NXP Semiconductors’ initial digital cockpit partnership with Foxconn that was announced last December. The digital cockpit partnership is based on the NXP Software Defined Radio platform and NXP i.MX applications processors.

NXP Semiconductors said that the main focus of the expanded partnership is aimed at driving the efforts of Foxconn in electrical vehicle (EV) platforms. The Taiwanese firm will tap the former’s system expertise and electrification portfolio.

The second priority of the partners will be connectivity solutions, which will be offered by utilising the latest NXP S32 domain and zonal controller family for gateways and vehicle networking control. Besides, the partners will work on progressing secure car access with the use of ultra-wideband (UWB) and Bluetooth Low Energy (BLE).

A third aspect of the collaboration is safe automated driving augmented by the radar solutions of the Dutch firm.

NXP Semiconductors will also provide support for hardware and software and will make use of the expertise of its third party ecosystem in the areas of electrification, automation, and connectivity.

NXP Semiconductors president and CEO Kurt Sievers said: “We are proud to join forces with Foxconn today to support its ambitious leap into automotive and to jointly address the challenges and opportunities of a new generation of smart connected vehicles, especially Foxconn’s new electric vehicle platform.

“The auto industry must become faster and more efficient, and NXP is pleased to extend its technology portfolio to enable electrification, next generation architectures, smart and secure car access systems and more.”