According to the company, the 3nm technology will generate end products with a market value of $1.5 trillion within five years of volume production
Volume production of 3nm chips begins at TSMC's Fab 18. (Credit: Taiwan Semiconductor Manufacturing Company Limited)
Taiwan Semiconductor Manufacturing (TSMC) has started volume production of 3nm chips at its Fab 18 in the Southern Taiwan Science Park (STSP) in Taiwan.
According to the Taiwanese firm, its 3nm process is the most advanced semiconductor technology in terms of transistor technology and in power, performance, and area (PPA).
The technology is said to offer up to 1.6X logic density gain and power reduction of 30-35% at the same speed compared to the 5nm (N5) process.
The 3nm technology will generate end products with a market value of $1.5 trillion within five years of volume production, stated TSMC.
Additionally, the semiconductor manufacturing firm conducted a topping ceremony for its Fab 18 phase 8 facility.
Each of TSMC Fab 18’s phases one through eight features a cleanroom with an area of 58,000m2 which is roughly double the size of a standard logic fab.
The total investment in Fab 18 by the company is expected to be more than NT$1.86 trillion ($60.5bn). The facility is also anticipated to generate over 23,500 construction jobs and more than 11,300 high-tech direct job opportunities.
Besides, TSMC announced that its global research and development (R&D) centre in the Hsinchu Science Park will formally launch in Q2 2023.
TSMC chairman Mark Liu said: “This 3nm Volume Production and Capacity Expansion Ceremony demonstrates that we are taking concrete action to develop advanced technology and expand capacity in Taiwan.
“We aim to grow together with our upstream and downstream supply chain and develop future talent from design to manufacturing, packaging and testing, equipment, and materials to provide the most competitive advanced process technology and reliable capacity for the world and drive technology innovation in the future.”
In December 2022, TSMC started construction of its second semiconductor manufacturing facility in Phoenix, Arizona, to take its overall investment in the American state to around $40bn.