The facility will be constructed at Kaga Toshiba Electronics, which is the company’s primary production base for discrete semiconductors
Illustration of the new 300mm wafer fabrication facility. (Credit: Business Wire)
Toshiba Electronic Devices & Storage revealed plans to expand its power semiconductor production capacity with a new 300mm wafer fabrication facility in Japan’s Ishikawa Prefecture.
The facility will be built at Kaga Toshiba Electronics, which is the company’s main production base for discrete semiconductors.
Toshiba Electronic Devices & Storage stated: “Power devices are essential components for managing and reducing power consumption in every kind of electronic equipment, and for achieving a carbon-neutral society.
“Current demand is expanding on vehicle electrification and the automation of industrial equipment, with very strong demand for low-voltage MOSFETs (metal oxide semiconductor field-effect transistors) and IGBTs (insulated-gate bipolar transistors) and other devices.”
Toshiba Electronic Devices & Storage said that the construction of the wafer fabrication facility will be carried out in two phases. This approach will help in optimising the pace of investment against market trends, said the Japanese firm.
Construction is slated to start in spring 2023 and is aimed to be wrapped up in spring 2024.
The company aims to begin production from phase 1 within fiscal 2024. After phase 1 achieves full capacity, the production capacity of Toshiba Electronic Devices & Storage for power semiconductors is expected to grow 2.5 times from what it was in fiscal 2021.
According to the company, the wafer fabrication facility will have an earthquake-proof structure and improved BCP systems, which include dual power supply lines. To reduce environmental burdens, the facility will have the latest energy-saving manufacturing equipment, said Toshiba Electronic Devices & Storage.
The company plans to introduce artificial intelligence and automated wafer transportation systems to boost product quality and production efficiency at the wafer fabrication facility.
Toshiba Electronic Devices & Storage is owned by Japanese conglomerate Toshiba. In November 2021, Toshiba said that it will split into three standalone companies to enhance shareholder value.
Device Co., which will be one of the three standalone firms, will own Toshiba Electronic Devices & Storage.