The processor range includes the new network-optimised N-SKUs and verified solution blueprints for speeding up time to market


Intel 3rd Gen Xeon Scalable processors expected to help in accelerating 5G network transformation. (Credit: Intel Corporation)

Intel has launched the 3rd Gen Xeon Scalable processors (code-named Ice Lake) for data centres, with an aim to accelerate 5G network transformation.

The third-generation processor range includes the new network-optimised N-SKUs and verified solution blueprints that speed up time to market, said Intel.

According to the semiconductor chip manufacturer, the new N-SKUs provide an average of 62% more performance on a variety of largely deployed 5G and network workloads, compared to the previous generation.

Intel also said that it has commenced sampling next-generation Intel Xeon D processors, which are designed to work in space and power-constrained environments at the edge.

Intel network platforms group corporate vice president and general manager Dan Rodriguez said: “We are further unleashing the capabilities of 5G and the power of the intelligent edge with our latest network-optimised 3rd Gen Intel Xeon Scalable processors.

“Designed to support diverse network environments, our newest 3rd Gen processors and platform ingredients enable global communications service providers to deliver the next breakthrough in network innovation for even richer consumer and enterprise use cases.”

The company said that the new network-optimised SKUs are suitable for wireless core, network edge workloads, wireless access, and also security appliances.

In order to address security for 5G networks, Intel Software Guard Extensions have been integrated into the 3rd Gen Xeon Scalable processor to facilitate channel setup and communication between the 5G control functions in a secured manner.

The new Intel Xeon Scalable processors can be paired with the company’s platform ingredients and software suite. This means that the new processors can be paired with Intel FPGAs, Intel Optane persistent memory, Intel Ethernet 800 series adapters, OpenNESS, FlexRAN, Intel Smart Edge, and Open Visual Cloud.

The company said that Agilex 10 nanometer (nm) FPGAs are being used in wireless core and access segments. This gives capabilities in infrastructure acceleration and for other useful features to complement core and access workloads running on the new third-generation processors.

Last month, Intel CEO Pat Gelsinger revealed plans to invest nearly $20bn for constructing two new semiconductor factories in Arizona, US.