The company will initially open centres in France and Portugal where it plans to bring together teams associated with chip design and embedded software

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Capgemini is a founding member of the Intel Foundry Services Accelerator Design Services Alliance. (Credit: Jakub Hałun/Wikimedia Commons)

Capgemini revealed plans to open semiconductor design services centres in Europe for supporting Intel’s programme of chip manufacturing and ecosystem design services.

The French IT services provider is a founding member of the Intel Foundry Services (IFS) Accelerator Design Services Alliance, that was formed in February 2022.

Capgemini alongside Intel Foundry Services and other partners in the IFS Accelerator ecosystem, aims to offer a full variety of chip design, manufacturing, and semiconductor ecosystem services to Intel Foundry Services’ customers.

The initiative is expected to help bolster the production capacity of next-generation chips in Europe to better support regional firms and build resilience in the region’s semiconductor supply chains.

Capgemini engineering CEO and group executive board member William Rozé said: “In collaboration with Intel and the alliance partners, Capgemini is driving the next generation of semiconductor innovation, scaling its silicon engineering expertise in step with the new Intel Foundry Services business.

“Expanding access to leading edge chip design for Intel Foundry Services customers, we will contribute to make services more readily available within Europe and to help meet the fast-growing market demand in the region.”

Capgemini said that its semiconductor design services centres in Europe will offer time zone-friendly resources and support for Intel Foundry Services’ European customers.

The company will initially open such centres in France and Portugal where it plans to bring together teams associated with chip design and embedded software.

According to Capgemini, the design centres will provide silicon engineering expertise along with the company’s experience in working with the latest process and packaging technologies of Intel.

The teams working at the semiconductor design services centres are expected to take on sub-7nm chip and other challenging designs for the latest generation of high-performance and ‘intelligent’ products.

The silicon engineering services to be provided at the centres include end-to-end chip design, process migration services, post-silicon validation, and support for embedded software, board, and system hardware.