EC proposes EU Chips Act to address semiconductor shortages
The European Commission (EC) has proposed the European Chips Act (EU Chips Act) to tackle shortages in semiconductors and bolster the technological sovereignty of Europe. According to the
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The European Commission (EC) has proposed the European Chips Act (EU Chips Act) to tackle shortages in semiconductors and bolster the technological sovereignty of Europe. According to the
IBM has unveiled a new data resilience solution called IBM FlashSystem Cyber Vault to enable companies to improve detection of ransomware and other cyberattacks and quickly recover from
Intel Foundry Services (IFS) has launched an ecosystem alliance called IFS Accelerator to enable a seamless journey for foundry customers in bringing their silicon products from idea to
PriceRunner, a Swedish price comparison service, has sued Google for a preliminary amount of around SEK22bn (€2.1bn) in a Stockholm court over alleged manipulation of search results. The
Nvidia and SoftBank Group have scrapped their previously announced transaction under which the former agreed to acquire UK-based chip design provider Arm for $40bn from the Japanese conglomerate.
Volvo Cars and Swedish battery company Northvolt will invest nearly SEK30bn ($3.3bn) to construct a new battery manufacturing plant in Gothenburg, Sweden. Slated to begin operations in 2025,
Toshiba has decided to split into two standalone companies instead of an earlier announcement of reorganising itself into three entities with an aim to boost shareholder value. The
Meta has been fined £1.5m by the UK Competition and Markets Authority (CMA) for breaching the latter’s enforcement order pertaining to the social media technology firm’s acquisition of
IBM and the Quebec government in Canada have launched a new technology hub called Quebec-IBM Discovery Accelerator, which will focus on developing new projects, collaborations, and skills-building initiatives.
Toshiba Electronic Devices & Storage revealed plans to expand its power semiconductor production capacity with a new 300mm wafer fabrication facility in Japan’s Ishikawa Prefecture. The facility will